Infineon Technologies has launched a quad-phase power module for vertical power delivery for high-current AI accelerators in data centers.
The TDM2454xx quad-phase power modules support 2A per sq mm, or up to 280A, for AI accelerators by using the four phases. The vertical power allows the devices to be closer to the accelerator chips to reduce losses.
The modules use the Infineon OptiMOS 6 silicon trench N-channel MOSFETs with an integrated embedded capacitor layer within the package to boost the electrical and thermal efficiencies and a low-profile magnetic design for a 5mm module height.
The footprint of 10x9mm² is designed to enable module tiling and improve current flow that enhances electrical, thermal, and mechanical performance.
These can be combined with Infineon’s XDP controllers and follow the TDM2254xD and the TDM2354xD dual-phase power modules introduced by Infineon last year.
“We are proud to expand our high-performance AI data center solutions with the TDM2454xx VPD modules,” said Rakesh Renganathan, Vice President Power ICs at Infineon Technologies. “We take a three-dimensional design approach and leverage our industry-leading power devices, packaging technologies and extensive systems expertise to provide high-performance and energy-efficient computing solutions as part of our mission to drive digitalization and decarbonization.”